Multilayer 12 layers HDI Printed circuit board, 3+N+3 structure

Multilayer 12 layers HDI Printed circuit board, 3+N+3 structure 1. PCB P/N:84312 2. Layer count:12 layer, 3+N+3 structure 3. Material: FR4 TG180 4. Board thickness: 1.5mm 5. Copper thickness: 1oz 6. Minimum drill size: 0.1mm 7. Minimum trace & gap: 0.1mm 8. BGA pad size: 0.32mm 9. Surface finish: immersion gold 10. green solder mask, with impedance control 11. Special technology: blind and buried via 12. Via in pad plugged & plated shut, stacked vias 13. Blind drill: layer 3+N+3 structure 14. Applications: industry control 15. One stop turnkey EMS service, including material procurement, SMT and thru-hole assembly, box build assembly 16. UL recognized and RoHS compliant