High Density Interconnect PCB

General Information for High density pcb (HDI PCB) HDI pcb is the abbreviation for High Density Interconnect pcb or High Density pcb.An HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density or reducing form factor. High Density PCB is used extensively in applications and industries including: ● Cell phone ● GPS ● Telecom ● ASemiconductor ● Automotive ● Military ● Medical ● Instrumentation 1. 6L HDI printed circuit board for Intercom 6L High density PCB (HDI PCB) for intercom Board dimensions: 110 x 166mm Finished board thickness: 1.2mm Material: FR-4 Tg150 Minimum holes size: 0.1mm Minimum line width/clearance: 3.5/3.5mil Copper thickness: 1oz Solder mask: top and bottom (color: green) Silkscreen: top (color: white) Finish: immersion gold (top and bottom) Board stack up: 1 + 4 + 1 2. 6 Layers HDI PCB 6L High density PCB (HDI PCB) for intercom Board dimensions: 80 x 120mm Finished board thickness: 1.0mm Material: FR-4 Tg150 halogen free Minimum holes size: 0.1mm Minimum line width/clearance: 2/3mil Copper thickness: T oz (12um) Solder mask: top and bottom (color: Blue) Silkscreen: top (color: white) Finish: immersion gold (top and bottom) Board stack up: 1 + 4 + 1 3. 8L Cell phone HDI board PCB 8layers High density PCB (HDI PCB) for cell phone Base material: FR4, Tg150 Layer count: 8 layers (HDI PCB) Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.075mm Minimum line spacing: 0.075mm Laser drilling + blind and buried drilling Impedance control Stack up: 1+6+1 4. 10L High density printed circuit board 10layers HDI PCB Base material: FR4, Tg170 Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.1mm Minimum line spacing: 0.1mm Laser drilling + blind and buried drilling Impedance control Board stack up: 1+8+1 Impedance control 5. 10L High Density Interconnect pcb 10L High Density Interconnect board Laminate: FR4, Tg150 Board thickness: 1.6mm Copper thickness: 17.5um (Hoz) for all layers Solder resist: green color Surface Finish: Immersion gold Trace width/width: 0.89/0.1mm Min. holes:0.1mm Controlled Impedance Board stack up: 1+1+6+1+1 Application: Industry control 6. 10L stage 2 Automotive HDI PCB Layer count: 2 stage 10 layer Board thickness：1.0mm Dimension：160*130mm Raw material：FR4 EM825 Copper thickness on the board surface：≥35um Copper thickness in the hole barrel：20um Min.line width/space：0.075mm Minimum hole diameter：0.1mm Surface finishing：immersion gold≥2u" Application：automotive driving recorder 7. 10L every layer interconnection(ELIC) HDI PCB Layer count: 10 layer Board thickness：0.80mm Raw material：FR4 370HR Min.line width/space：0.075/0.075mm Minimum hole diameter：0.10mm Surface finishing：ENIG Plug via-in-pad by resin and plate flat