Copper Polishing Slurry

According to the characteristics of copper material and high requirements of the 3C fabricate, Kona nano alumina water-based copper cmp slurry provides a good surface finish with no compromise on the polishing rate.

Polishing Slurry for 3C Copper Accessories

1

Copper is a soft metal (Mohs hardness 3), and it is a highly reactive metal and it oxidized very easily. That increases the difficulty of polishing Copper Accessories for computer and mobile phone.

2

Our cu cmp slurry is designed for the 3C Copper Accessories polishing process (which is mostly a CMP process ), it is a water-based nano alumina polishing slurry added an additive special for the characteristic of copper.

3

Kona Copper Polishing Slurry provides a mirror-like surface finish with no compromise on removal rate, and also can achieve a good gloss value, such as hundreds gu.

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